SE01: Semiconductor Tooling Quality & Performance

Course Contents (2-day training):

1. Tooling Materials Understanding
2. Tool Making Process and Control
3. Transfer Mould Quality & Performance
4. Trim & Form Tool Quality & Performance

SE02: Leadframe Materials & Trim-and-Form Quality

Course Contents (2-day training):

1. Leadframe Structure & Quality Issues
2. Leadframe Materials & Characteristics
3. Leadframe Sheared Edge Finish and Control
4. Leadframe Formability & Processing Control

SE03: Encapsulation Materials & Transfer Moulding Control

Course Contents (2-day training):

1. Moulding Compound Understanding
2. Encapsulant Properties  & Encapsulantation Requirement
3. Transfer Moulding Process  
4. Materials and Process Optimization

SE04: Hardening & Surface Coating for Semiconductor Tooling

Course Contents (2-day training):

1. Metallurgical Principle of Heat Treatment
2. Hardening Process & Common Problems
3. Hard Surface Coatings Techniques
4. Hard Surface Coatings Quality

SE05: Microelectronic Package Defects Understanding and Prevention

Course Contents (2-day training):

1. Residual Stress & Warpage
2. Delamination & Cracking
3. Corrosion Failures
4. Electrical Migration & Tin Whisker